发明名称 SUBSTRATE TREATING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a substrate treating system which suppresses reliquefaction of a vaporized material and can improves the productivity. SOLUTION: In the substrate treating system where liquid material is vaporized and is introduced into a treatment room and a desired film is formed on a substrate by equipped with a vaporizer which is provided with a vaporization chamber having several outlets, a flow passage for discharging the vaporized material from one of the outlets via a valve is arranged; another flow passage for supplying the vaporized material to a reaction chamber from another outlet via a valve is arranged; and discharge and supply of the vaporized material is switched by operating opening and closing of the valves. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008294190(A) 申请公布日期 2008.12.04
申请号 JP20070137636 申请日期 2007.05.24
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 ONO KENJI;KATO TSUTOMU;MORIKAWA ATSUSHI;OKADA ITARU
分类号 H01L21/31;C23C16/448 主分类号 H01L21/31
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