发明名称 |
Packages and assemblies including lidded chips |
摘要 |
A lidded chip is provided which includes a chip having a major surface and a plurality of first chip contacts exposed at the major surface. A lid overlies the major surface. A chip carrier is disposed between the chip and the lid, the chip carrier having an inner surface confronting the major surface and an outer surface confronting the lid. A plurality of first carrier contacts of the chip carrier are conductively connected to the first chip contacts. A plurality of second carrier contacts extend upwardly at least partially through the openings in the lid.
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申请公布号 |
US2008296717(A1) |
申请公布日期 |
2008.12.04 |
申请号 |
US20070809780 |
申请日期 |
2007.06.01 |
申请人 |
TESSERA, INC. |
发明人 |
BEROZ MASUD;HABA BELGACEM;NYSTROM MICHAEL J.;CRISP RICHARD DEWITT;HUMPSTON GILES |
分类号 |
H01L31/0203;H01L21/58;H01L23/02 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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