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发明名称
PLATED SUBSTRATE AND ITS FABRICATION METHOD
摘要
A plated substrate includes a substrate, a resin formed body having a specified pattern including catalytic metal that functions as a catalyst for electroless plating, and a metal layer formed on a top surface of the resin layer.
申请公布号
US2008299356(A1)
申请公布日期
2008.12.04
申请号
US20070866038
申请日期
2007.10.02
申请人
SEIKO EPSON CORPORATION
发明人
KANEDA TOSHIHIKO;KIMURA SATOSHI;FURIHATA HIDEMICHI;KIJIMA TAKESHI
分类号
B32B7/14;B05D1/36
主分类号
B32B7/14
代理机构
代理人
主权项
地址
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