发明名称 PLATED SUBSTRATE AND ITS FABRICATION METHOD
摘要 A plated substrate includes a substrate, a resin formed body having a specified pattern including catalytic metal that functions as a catalyst for electroless plating, and a metal layer formed on a top surface of the resin layer.
申请公布号 US2008299356(A1) 申请公布日期 2008.12.04
申请号 US20070866038 申请日期 2007.10.02
申请人 SEIKO EPSON CORPORATION 发明人 KANEDA TOSHIHIKO;KIMURA SATOSHI;FURIHATA HIDEMICHI;KIJIMA TAKESHI
分类号 B32B7/14;B05D1/36 主分类号 B32B7/14
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