发明名称 Side-Emitting LED Package with Improved Heat Dissipation
摘要 A light source and a method for making the same are disclosed. The light source includes a lead frame, an integrated circuit chip and a body. The lead frame has first and second sections. The first section includes a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is bonded to the first section in the chip mounting area and is in thermal contact with the chip mounting area. The body has top, bottom, and side surfaces. The first extension is bent to provide a heat path from the chip mounting area to the side surface, a surface of the first extension that is not in contact with the side surface forming a first planar bonding surface. The heat path has less thermal resistance than a heat path through the lateral portion.
申请公布号 US2008298081(A1) 申请公布日期 2008.12.04
申请号 US20070755982 申请日期 2007.05.31
申请人 OON SIANG LING;MOK THYE LINN;LOON KAH YAN 发明人 OON SIANG LING;MOK THYE LINN;LOON KAH YAN
分类号 H01L33/48;H01L33/62;H01L33/64 主分类号 H01L33/48
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