| 摘要 |
The low melting solder glass contains, in wt. % on an oxide basis, >1-2, SiO2; 5-10, B2O3; 4.5-12, ZnO; 79-88, Bi2O3; and 0.6-2, Al2O3, and a weight ratio of SiO2 to Al2O3 of <2. The solder glass preferably contains from 80.5 to 85 wt. % of Bi2O3 and is free of lead. This solder glass has a linear thermal expansion coefficient alpha(20-300) of <11.5x10-6/K and a transformation temperature Tg of <380° C. A solder glass preparation for connecting or sealing a glass part with a metal part contains the low melting solder glass and up to 20 wt. % of beta-eukryptite, cordierite, mullite, willemite or zircon.
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