| 摘要 |
<p>A heat-releasable pressure-sensitive adhesive sheet that excelling in rugged surface follow-up property, exhibits a satisfactory adhesive strength even when a bonding face of adherend is rough, and that in the use as a pressure-sensitive adhesive sheet for dicing of a semiconductor substrate with rough surface of sealing resin, etc., inhibits chip scattering, and that after the completion of working, can be easily stripped by heating with no stress imparted to the adherend. Further, there is disclosed a method of working an adherend, especially a process for manufacturing an electronic part, with the use of the pressure-sensitive adhesive sheet. The pressure-sensitive adhesive sheet is a heat-releasable pressure-sensitive adhesive sheet having a thermally expandable pressure-sensitive adhesive layer containing thermally expandable microglobules superimposed via a rubbery organic elastic layer on at least one major surface of a base material, characterized in that the rubbery organic elastic layer has a thickness of 1.5 to 42 times that of the thermally expandable pressure-sensitive adhesive layer.</p> |
