CONNECTING METHOD, CONNECTION DEVICE, AND CONNECTION STRUCTURE OBTAINED BY USING SAME CONNECTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a connecting method in which a connection structure having a semiconductor element reduced in curvature can easily be obtained, a connection device, and the connection structure. SOLUTION: Disclosed is the connecting method of connecting the semiconductor element 2 and a substrate 1 in an electrically conductive state by interposing a wiring connection material between the semiconductor element 2 and the substrate 1 having wiring and then heating and pressing the wiring connection material 3 from the side of the semiconductor element 2, the connecting method being characterized in that before heating and pressing the wiring connection material 3, a support member 7 having a thermal conductivity of≤1W×m-1×K-1at 25°C is provided on a first surface of the substrate 1 on the opposite side from a surface that the wiring connection material 3 comes into contact with, the area of a second surface of the support member 7 on the side of the semiconductor element 2 is larger than the area of a third surface of the semiconductor element 2 which comes into contact with the wiring connection material 3, and the semiconductor element 1 is disposed inside an outer periphery of the support member 7 when the semiconductor element 2 is viewed in a direction from the semiconductor element 2 to the substrate 1. COPYRIGHT: (C)2009,JPO&INPIT