| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for dividing a wafer which can reliably form an altered layer in predetermined positions in the wafer along streets and can safely transport the wafer even when the wafer is formed with a small thickness. SOLUTION: The method for dividing the wafer includes a step by which a protecting plate having an adhesive whose adhesive force is decreased by external stimuli is stuck on the surface of the wafer, an altered layer forming step by which the wafer is irradiated with laser light beams which exhibit transparency with respect to the wafer from the back side of the wafer along the streets and the altered layer of a thickness corresponding at least the finished thickness of a device in the wafer from the surface of the wafer is formed, a backgrinding step by which the wafer is formed into the finished thickness of the device, a wafer supporting step by which the back side of the wafer is stuck on dicing tape, a step by which the adhesive material of the protecting plate is subjected to external stimuli and its adhesive force is decreased, a step by which the protecting plate is peeled from the surface of the wafer and a step by which the wafer is subjected to an external force and is broken along the street. COPYRIGHT: (C)2009,JPO&INPIT
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