| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing epoxy resin composition which has excellent adhesiveness to semiconductors, lead frames and the like, without deteriorating the flowability during molding, and has excellent reflow crack resistance, and to provide a semiconductor device. SOLUTION: This sealing epoxy resin composition comprises an epoxy resin, a phenol curing agent, and an inorganic filler as essential components, characterized by further comprising 3,6-dithia-1,8-octanediol. COPYRIGHT: (C)2009,JPO&INPIT
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