| 摘要 |
A wiring board is provided to maintain reliability of connection and not to obstruct the miniaturization of wiring and not to cause performance degradation of the wiring board by including a pad for outside connection. A wiring board comprises: Insulating layer(7); a wiring layer installed at the single-side of the insulating layer; a pad for outside connection(1) installed at the other surface of the insulating layer; a surface coating layer(2), which is formed on the outside pad, for connection with the external circuit; a plurality of wiring layers; and a plurality of insulating layers installed between a plurality of wiring layers. The area of the pad for outside connection is smaller than the area of the surface coating layer. The pad for outside connection characterizes to be the pad for mounting the electronic component including the semiconductor device etc. in the wiring board. |
