| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a component built-in module capable of performing a mounting inspection and characteristics inspection before building-in components, improving a yield, and enhancing an overall strength. <P>SOLUTION: The component built-in module has an electrically insulating layer (301), a wiring disposed at both principal planes of the electrically insulating layer (301), and a via (303) connecting the wiring. At least one component (1004, 1006) selected from electronic parts and a semiconductor is embedded in the electrically insulating layer (301), and at least one of the wiring is formed on the surface of a wiring substrate (308). Further, the module has a shield layer (1010) at a ground potential between at least one of a plurality of components (1004, 1006) disposed inside the electrically insulating layer (301) and mounted in the wiring at both principal planes of the electrically insulating layer (301). The components (1004, 1006) embedded inside the electrically insulating layer (301) is mounted on the wiring and integrated before embedding. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
