发明名称 PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a small-sized and high-density printed wiring board with which a component loading area is substantially reduced by forming a coil element with sufficient inductance inside the printed wiring board, and a method of stably manufacturing the printed wiring board at a low cost. <P>SOLUTION: In the printed wiring board of two or more layers where a coil with the inductance is formed, the coil has a spiral wiring pattern 7 and a conductive magnetic body part 30 disposed at the center of the wiring pattern and electrically connected with the wiring pattern, and the layers are electrically connected by the conductive magnetic substance part. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008294285(A) 申请公布日期 2008.12.04
申请号 JP20070139044 申请日期 2007.05.25
申请人 NIPPON MEKTRON LTD 发明人 ISHIHARA KEIEN
分类号 H05K3/46;H01L23/12;H05K1/11;H05K1/16;H05K3/40 主分类号 H05K3/46
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