| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multi-chip module of a PoP (Package on Package) structure which can increase a connection reliability. <P>SOLUTION: In a semiconductor package 1 including a first semiconductor package 2 having a first semiconductor element 7 mounted on a first wiring circuit board 8 and sealed with a resin and also including a second semiconductor package 3 having a second semiconductor element 11 mounted on a second wiring circuit board 12 and sealed with a resin, the first and second semiconductor packages being bonded with a soldering material 6, a recess is formed in an end of each of the first and second wiring circuit boards, side and bottom surfaces of the recess are plated with copper to form first and second copper-made pads 20 and 23, and the first and second copper-made pads are joined with a soldering material. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
