| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board that can be efficiently manufactured, and to provide a manufacturing method therefor. SOLUTION: A circuit board 1 has a substrate main body 4 composed of a metal substrate 2 and a printed-circuit board 3 prepared on the metal substrate 2, a surface-mounted component 5 mounted on the substrate main body 4, and stud members 6 pressed into through-holes 7 drilled on the substrate main body 4, and is fixed onto equipment chassis through the stud member members 6. The substrate main body 4 has a ground pattern 10 prepared on a side periphery of the through-hole 7 in the printed-circuit board 3, the stud member 6 is pressed into the through-hole 7 from the ground pattern 10 side where a solder 15 is printed, and the metal substrate 2 and the ground pattern 10 are electrically connected. COPYRIGHT: (C)2009,JPO&INPIT
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