发明名称 SUBSTRATE TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve a substrate heating efficiency and shorten a substrate heating time for throughput improvement and suppress heat discharge to the periphery, prevent metal pollution and the generation of a foreign substance for quality improvement in substrate treatment. SOLUTION: A substrate treating apparatus for heating and treating a substrate 4 housed in a treatment chamber 1 comprises a substrate mounting stand 3 on which the substrate is mounted and heated and a heat reflection board 25 opposed to the substrate mounting stand 3. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008294104(A) 申请公布日期 2008.12.04
申请号 JP20070136208 申请日期 2007.05.23
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 OGAWA UNRYU
分类号 H01L21/205;C23C16/46;H01L21/3065 主分类号 H01L21/205
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