发明名称 |
METHOD OF MANUFACTURING WIRING SUBSTRATE AND WIRING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To improve adhesion strength of a plating film even if a resin-metal composite layer is thin, 10 to 200 nm in concrete. SOLUTION: A resin-metal composite layer is subjected to plating, and then a resin substrate is heated to shrink a resin matrix. The precipitated plating metal is surrounded by the shrunk resin, so that the adhesion strength of a plating film can be further improved. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2008294077(A) |
申请公布日期 |
2008.12.04 |
申请号 |
JP20070135768 |
申请日期 |
2007.05.22 |
申请人 |
TOYOTA MOTOR CORP;TOYOTA INDUSTRIES CORP |
发明人 |
BESSHO TAKESHI;KUMAGAI KYOKO;YOSHIDA TAKASHI;NAGAMURA MANABU;SHIMO TOSHIHISA |
分类号 |
H05K3/18;C23C18/30;H05K3/22;H05K3/38 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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