发明名称 METHOD OF MANUFACTURING WIRING SUBSTRATE AND WIRING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To improve adhesion strength of a plating film even if a resin-metal composite layer is thin, 10 to 200 nm in concrete. SOLUTION: A resin-metal composite layer is subjected to plating, and then a resin substrate is heated to shrink a resin matrix. The precipitated plating metal is surrounded by the shrunk resin, so that the adhesion strength of a plating film can be further improved. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008294077(A) 申请公布日期 2008.12.04
申请号 JP20070135768 申请日期 2007.05.22
申请人 TOYOTA MOTOR CORP;TOYOTA INDUSTRIES CORP 发明人 BESSHO TAKESHI;KUMAGAI KYOKO;YOSHIDA TAKASHI;NAGAMURA MANABU;SHIMO TOSHIHISA
分类号 H05K3/18;C23C18/30;H05K3/22;H05K3/38 主分类号 H05K3/18
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