| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing film which leaves little cut chips (string-like or whisker-like chips occurring from a film after dicing) after a dicing step of a semiconductor wafer, is excellent in adhesion between a film front layer and an acrylic-based adhesive and leaves no acrylic-based adhesive on a chip side (that is, contamination of a semiconductor chip can be prevented) after the semiconductor chip is picked up after dicing. SOLUTION: A dicing substrate film of at least a two-layered structure including an A layer and a C layer laminated and a dicing film are provided, wherein the A layer contains a resin composition consisting of the acrylic-based resin of 10-50 wt.% and a styrene-conjugate diene block copolymer hydrogen additive of 50-90 wt.% and the C layer contains thermoplastic resin with rubber elasticity. COPYRIGHT: (C)2009,JPO&INPIT
|
