发明名称 INTERFERENCE SHIELDED ELECTRONICS MODULE AND METHOD FOR PROVIDING THE SAME
摘要 Interference shielded, for example a RFI and/or EMI shielded, electronics module, such as a circuit board (10) or a printed circuit or a corresponding electronics module, which interference shield forms a contact (4) with at least one edge zone (11) of the circuit board layers (12, 13, 14) of the circuit board, which contact functions in the electronics module as a means of grounding and which circuit board comprises: an outermost electrically conductive layer (3) providing the interference shield of the electronics module; at least one circuit card layer (12, 13, 14) unit comprising electronics components and a wiring pattern embedded into a filling material of the circuit board layer: and encapsulating activation material layer (2), which is advantageously a substrate layer or a resin layer, and which overlays above the topmost circuit board layer (12), and which is arranged into a space between the outermost layer (3) and topmost circuit board layer (12) to be therein conformingly against the inner surface of the outermost layer (3) for isolating the electronic components and the wiring pattern from outermost layer, whereby for providing the interference shield, there is a direct conductive contact (4) at the side edge (21) of the circuit board between the outermost layer (3) and the edge zone (11) of the circuit board layer (12, 13, 14) providing the grounding. Characteristic to the shielded module is that the outermost shield layer (3) is essentially a single-layered covering and an outermost surface layer of the circuit board unit (10). Characteristic to the method is that the same comprises steps: a panel (1) comprising several circuit board units (10) is covered by an encapsulating layer (2); individual circuit boards (10) are separated from the panel along separation lines (A-A, B-B) of the circuit board units; and a surrounding shield layer is applied as the outermost layer, which forms an electrically conductive interference shield.
申请公布号 WO2008145804(A2) 申请公布日期 2008.12.04
申请号 WO2008FI00059 申请日期 2008.05.26
申请人 ELCOTEQ SE;LEHTIMAEKI, KAIJA;MAAKANSAS, GRETA;HEIKONEN, MIKKO;MAEKELAE, KIMMO 发明人 LEHTIMAEKI, KAIJA;MAAKANSAS, GRETA;HEIKONEN, MIKKO;MAEKELAE, KIMMO
分类号 H05K9/00;H01L23/552;H05K1/02;H05K3/00 主分类号 H05K9/00
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