SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD, AND DISPLAY AND ITS MANUFACTURING METHOD

摘要

A semiconductor device in which a semiconductor has good heat dissipation efficiency, a display employing such a semiconductor device and a method for manufacturing a semiconductor device. A conductive pattern providing a terminal portion for connecting a semiconductor and further providing first and second terminal portion for external connection on the opposite sides of the terminal portion for connecting a semiconductor is formed on the surface of a flexible insulating substrate to produce a flexible printed wiring board on which a semiconductor is mounted and connected with the terminal portion for connecting a semiconductor in the conductive pattern. In such a semiconductor device, a slit is formed in the insulating substrate to surround the semiconductor while leaving a part around the semiconductor thus providing a semiconductor holding part. The insulating substrate is turned down such that the surface comes inside excepting the semiconductor holding part, and the slit is formed such that the mounted semiconductor projects from the backside of the insulating substrate to the outside when the first and second terminal portion for external connection are connected, respectively, with other components.