| 发明名称 |
INTEGRATED CIRCUIT PACKAGE WITH SOLDERED LID FOR IMPROVED THERMAL PERFORMANCE |
| 摘要 |
<p>An integrated circuit die includes a circuit surface and a back surface opposite the circuit surface. An underbump metallurgy is formed on a back surface. A layer of solder is formed on the underbump metallurgy.</p> |
| 申请公布号 |
WO2008147387(A1) |
申请公布日期 |
2008.12.04 |
| 申请号 |
WO2007US20975 |
申请日期 |
2007.09.28 |
| 申请人 |
LSI CORPORATION;KUTLU, ZAFER, S. |
发明人 |
KUTLU, ZAFER, S. |
| 分类号 |
H01L23/043;H01L23/34 |
主分类号 |
H01L23/043 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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