LEAD FRAME AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

摘要

A lead frame and a manufacturing method thereof, and a semiconductor device and a manufacturing method thereof are provided to prevent the deformation generated in the mount part while forming the repulsion processing unit on the lead frame. A lead frame(104) comprises the mount part(111), the electrode(112), the corner part(113), the repulsion processing unit, and the stress break-up part. The semiconductor device is mounted to the mount part. The semiconductor device mounted in the mount part is electrically connected to the electrode respectively. The corner part has the hanging lead piece(115) and the electrode connection piece(116). The hanging lead piece supports the electricity mount part. A plurality of electrodes is connected the electrode connection piece. The corner part connects a plurality of mount parts. The repulsion processing unit has the protruded part(117) and the concave part. The protruded part is formed into the thickness direction of the lead frame. The concave part is formed at the location corresponding to the protruded part. The repulsion processing unit is coated with the bag resin material soldering the semiconductor device.