| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device surely avoiding the mutual contacts of adjacent wires in bonded wires. <P>SOLUTION: In the manufacturing method for the semiconductor device, an electrode pad 10 for a semiconductor chip 1 and another electrode pad 20 for a printed board 2 are connected electrically by a bonding wire 3 with a bonding tool 4 in a wire bonding process. The bonding tool 4 is inserted between the adjacent bonding wires 3 and 3 in a wire disengaging process. The bonding tool 4 is moved in parallel in the direction of connecting the electrode pad 10 and the electrode pad 20. <P>COPYRIGHT: (C)2009,JPO&INPIT |
