发明名称 |
METHOD OF MANUFACTURING EPITAXIAL WAFER, AND EPITAXIAL WAFER |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for inexpensively manufacturing an epitaxial wafer having strong gettering performance without forming an epitaxial defect in an epitaxial layer by securely performing restoration heat treatment before a process for implanting carbon ions, forming a carbon ion implantation layer and forming a silicon epitaxial layer on an implantation face. SOLUTION: In the manufacturing method of the epitaxial wafer, the carbon ions are implanted, a carbon implantation layer is formed and heat treatment is performed in an atmosphere including ammonia or nitrogen by using a rapid heating/rapid cooling (RTA: rapid thermal annealing) device. The epitaxial layer is formed on a silicon wafer which is heat-treated. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2008294245(A) |
申请公布日期 |
2008.12.04 |
申请号 |
JP20070138548 |
申请日期 |
2007.05.25 |
申请人 |
SHIN ETSU HANDOTAI CO LTD |
发明人 |
MAGARI TAKEMINE;KOBAYASHI HIROYUKI;SAYAMA TAKASHI;TAKAMIZAWA SHOICHI;MITANI KIYOSHI;TOBE TOSHIMI |
分类号 |
H01L21/322;H01L21/205;H01L27/148 |
主分类号 |
H01L21/322 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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