发明名称 METHOD OF MANUFACTURING EPITAXIAL WAFER, AND EPITAXIAL WAFER
摘要 PROBLEM TO BE SOLVED: To provide a method for inexpensively manufacturing an epitaxial wafer having strong gettering performance without forming an epitaxial defect in an epitaxial layer by securely performing restoration heat treatment before a process for implanting carbon ions, forming a carbon ion implantation layer and forming a silicon epitaxial layer on an implantation face. SOLUTION: In the manufacturing method of the epitaxial wafer, the carbon ions are implanted, a carbon implantation layer is formed and heat treatment is performed in an atmosphere including ammonia or nitrogen by using a rapid heating/rapid cooling (RTA: rapid thermal annealing) device. The epitaxial layer is formed on a silicon wafer which is heat-treated. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008294245(A) 申请公布日期 2008.12.04
申请号 JP20070138548 申请日期 2007.05.25
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 MAGARI TAKEMINE;KOBAYASHI HIROYUKI;SAYAMA TAKASHI;TAKAMIZAWA SHOICHI;MITANI KIYOSHI;TOBE TOSHIMI
分类号 H01L21/322;H01L21/205;H01L27/148 主分类号 H01L21/322
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