| 摘要 |
PROBLEM TO BE SOLVED: To provide a build-up wiring board that not only prevents package warpage caused at room temperature and during reflow soldering thereof even if a package baseboard is made thin but also ensures the adequate dicing characteristics when allowing a semiconductor package to be individual pieces and reflow mounting to a mounting board. SOLUTION: This invention relates to the build-up wiring board for a semiconductor device where at least either of an interlayer insulating resin layer 15 or a wiring layer 14 is laminated on surfaces A and B of a core base material 13 having wires, and a build-up wiring layer is formed by allowing each wiring layer to be electrically connected through inner via holes. In the build-up wiring board, thermal expansion coefficient in a planar direction of the interlayer insulating resin surface side A on which a semiconductor element is mounted is greater than that in the planar direction of the interlayer insulating resin of a surface side B mounted on the mounting board. COPYRIGHT: (C)2009,JPO&INPIT |
