| 摘要 |
PROBLEM TO BE SOLVED: To provide a force sensor installed under the optimum shape or attaching condition in response to an installed place, an installed space or the like, by weakening properly an axial force applied onto a force sensor chip. SOLUTION: This force sensor is provided with a cushioning device, in the force sensor chip having a semiconductor substrate 502 having an acting part applied with a force, a support part for supporting the acting part and a connecting part for connecting the acting part and the support part, a glass plate 503 opposed to the semiconductor substrate, the first electrodes LE1-LB8 provided in the acting part of the semiconductor substrate, and the second electrodes UE1-UB8 provided in the glass plate opposedly to the first electrodes, and the cushioning device is provided with an input part 101, a sensor fixing part 102 for fixing the force sensor chip, an attenuation mechanism part 104 for attenuating an external force, and a transmission part 105 for transmitting an attenuation force of the external force, to the acting part. COPYRIGHT: (C)2009,JPO&INPIT
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