| 摘要 |
PROBLEM TO BE SOLVED: To provide a new method for producing a prepreg used for producing a laminate and a printed wiring board having reduced warpage. SOLUTION: The method for producing the prepreg includes a process where a long-length base material 1 is conveyed and the base material 1 is impregnated with resin varnish 3 in a dip tank 2, wherein first and second dip rolls 4, 5 forming a rotary axis in a direction orthogonal to a conveying direction of the base material 1 are arranged in the resin varnish 3, the upper circumferential face of the first dip roll 4 is contacted with the lower face of the base material 1, and thereafter, the lower circumferential face of the second dip roll 5 is contacted with the upper face of the base material 1 to impregnate the base material 1 with the resin varnish 3. COPYRIGHT: (C)2009,JPO&INPIT
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