发明名称 |
CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME |
摘要 |
An exemplary camera module includes a lens holder, a lens module, an image sensor chip, at least three apart bonding pads, and a light transmittance element. The lens module is received in the lens holder. The lens module includes a barrel and at least one lens received in the barrel. The image sensor chip includes a photosensitive area configured for receiving light transmitted through the lens module. The image sensor chip is attached to an end of the lens holder facing away from the lens module. The bonding pads are arranged on the image sensor chip around the photosensitive area. The light transmittance element is fixed on the image sensor chip via the at least three bonding pads. The present invention also relates to a method for manufacturing the camera module.
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申请公布号 |
US2008297645(A1) |
申请公布日期 |
2008.12.04 |
申请号 |
US20070857392 |
申请日期 |
2007.09.18 |
申请人 |
HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
LO SHIH-MIN;LEI AN-CHANG;WANG JEN-CHAO |
分类号 |
H04N5/225;G03B17/00;H01L21/00 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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