| 摘要 |
<p>A curable resin composition is provided to ensure low-dielectric constant, low dielectric loss tangent, excellent heat resistance, excellent mechanical property, excellent chemical resistance and excellent fire retardant characteristic by curing the curable resin composition at a low temperature. A curable resin composition comprises (a) a vinyl compound represented by the equation(1); a mixture of two kinds or more of vinyl compound(a) of the equation(1), in which structure is different; and at least one maleimide compound(b) selected from a group consisting of a maleimide compound(b) represented by the equation(5)-(8), wherein -(O-X-O) - shows the fraction of the equation(2) or the equation(3); -(Y-O) - shows the arrangement of the fraction of the equation(4) or the equation(4) or the random arrangement of at least two fractions; and a and b are an integer of 0 - 100.</p> |
