SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

According to the semiconductor package and manufacturing method thereof, the semiconductor chip is welded to the cooling fin with directly and it makes the thermal pathway short. The heat emission efficiency of the semiconductor package can be strengthened. The method for manufacturing a semiconductor package comprises as follows. A step is for contacting the one-side of the semiconductor chip(26) having the connection terminal(28) with the one-side of the cooling fin(20) having penetration hole(22). A step is for encapsulating the semiconductor chip by coating the insulating material(30) in the one-side of the cooling fin. A step is for being laminated the insulating layer(32) in the other side of the cooling fin. A step is for forming the first VIA(36) by punching the insulating layer and being electrically connected with the connection terminal.