SILICON PROBE CARD ASSEMBLY AND METHOD FOR BONDING THE SAME

摘要

The silicon probe card assembly and this bonding method are provided to enhance the productivity by cutting the silicon in the desired size according to the yield. The silicon probe card assembly comprises the probe(56), the probe beam portion(55), the silicon probe structure, the lower circuit board(51). The probe is contacted with the terminal of the inspection target object. The probe beam portion supports and electrically connects the probe. The silicon probe structure comprises the probe pillar section(54) connecting the probe beam portion and terminal of the lower part. The lower circuit board is made of the wiring of multilayer. The terminal connected with the conductivity adhesion material layer to the wiring of the lower circuit board is connected with the terminal connected to the probe pillar section of the silicon probe structure.