发明名称 ENCAPSULANTS FOR ELECTRONIC COMPONENTS
摘要 An electronic device comprising an electronic component encapsulated by a composition comprising crosslinked ethylene copolymer blended with from about 150 to about 1,000 parts by weight per million parts by weight (ppm) of the ethylene copolymer of fatty acid amide, and manufacture of the electronic device. One preferred electronic device is a photovoltaic solar cell module wherein the electronic component comprises photovoltaic cells and the composition is a transparent composition. In addition, a composition comprising ethylene copolymer blended with from about 150 to less than 500 parts by weight per million parts by weight (ppm) of the ethylene copolymer of fatty acid amide. Further, a transparent laminate comprising at least one layer of transparent glass and at least one layer of a transparent composition comprising an ethylene copolymer blended with from about 150 to 1,000 parts by weight per million parts by weight of the ethylene copolymer of a fatty acid amide.
申请公布号 EP1997164(A2) 申请公布日期 2008.12.03
申请号 EP20070753556 申请日期 2007.03.20
申请人 E.I. DU PONT DE NEMOURS AND COMPANY 发明人 HASCH, BRUCE, MICHAEL
分类号 H01L51/44;C08L23/08;H01L31/048 主分类号 H01L51/44
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