发明名称 Surface acoustic wave device and method for manufacturing the same
摘要 An SAW chip (11) where ones are balanced signal terminals and the others are unbalanced signal terminals is mounted on a mounting board (12) in a flip chip manner, and the mounting board (12) and a surface of the SAW chip are covered with resin (19). At that time, grounds of first and second SAW filters in the SAW chip (11) are connected together and an annular pattern (14) is formed so as to surround a signal pattern of the SAW chip (11) on the mounting board (12) on which the SAW chip (11) is mounted, and the annular electrode (14) is connected to a ground pattern.
申请公布号 EP1635456(A3) 申请公布日期 2008.12.03
申请号 EP20050019123 申请日期 2005.09.02
申请人 EPSON TOYOCOM CORPORATION 发明人 ONOZAWA, YASUHIDE
分类号 H03H9/00;H03H3/02;H03H9/05 主分类号 H03H9/00
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