Packaging of a microelectronic component, in particular a MEMS, in an airtight cavity

摘要

The method involves machining a microelectromechanical system (MEMS) structure (22) from an upper layer (14) to an intermediary oxide layer (16) of a silicon on insulator substrate (10). A hermetic cavity (38) is formed in an encapsulation cover (30), and a vent hole (40) emerging into the cavity is formed in the cover and the substrate. The substrate and the cover are bonded by silicon direct bonding. The structure is released by hydrofluoric acid vapor etching of the oxide layer via the hole. The hole is filled by glass or by depositing phosphosilicate. An independent claim is also included for: a microelectronic device comprising a cavity.