发明名称 THERMOSET RESIN COMPOSITION
摘要 The present invention provides a thermoset resin composition which contains polycarboxylic acid resin (A) and epoxy resin and/or oxetane resin (B) as essential ingredients and is capable of forming a transparent cured product having improved endurance in hot and humid conditions; an optical film obtained by curing the above-mentioned thermoset resin composition; and a laminated film obtained by applying the above-mentioned thermoset resin composition onto a film substrate and curing it. ® KIPO & WIPO 2009
申请公布号 KR20080105138(A) 申请公布日期 2008.12.03
申请号 KR20087023961 申请日期 2008.09.30
申请人 SHOWA DENKO K.K. 发明人 UCHIDA HIROSHI;SAKATA YUKO
分类号 C08L75/04;C08G18/08;C08L63/00;C09D175/04 主分类号 C08L75/04
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