发明名称 |
FLEXIBLE ASSEMBLY OF STACKED CHIPS |
摘要 |
A three-dimensional package consisting of a plurality of folded integrated circuit chips ( 100, 110, 120 ) is described wherein at least one chip provides interconnect pathways for electrical connection to additional chips of the stack, and at least one chip ( 130 ) is provided with additional interconnect wiring to a substrate ( 500 ), package or printed circuit board. Further described, is a method of providing a flexible arrangement of interconnected chips that are folded over into a three-dimensional arrangements to consume less aerial space when mounted on a substrate, second-level package or printed circuit board. |
申请公布号 |
EP1668745(A4) |
申请公布日期 |
2008.12.03 |
申请号 |
EP20030770552 |
申请日期 |
2003.09.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
VOLANT, RICHARD, P.;PETRARCA, KEVIN, S.;WALKER, GEORGE, F. |
分类号 |
H01R12/00 |
主分类号 |
H01R12/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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