发明名称 |
HEAT CURABLE RESIN COMPOSITION, OVERCOATING AGENT FOR FLEXIBLE CIRCUIT BOARD, AND SURFACE PROTECTIVE FILM |
摘要 |
Overcoating agents and thermosetting resin compositions of the invention give protective layers that have excellent adhesion to substrates and in particular to tin, excellent long-term reliability of electric insulation and small warpage. A thermosetting resin composition according to the invention includes a carboxyl group-containing urethane resin (A), a curing agent (B) and an acid anhydride (C) as essential components. A flexible circuit board overcoating agent includes the thermosetting resin composition. A surface protective layer of the invention comprises a cured product of the thermosetting resin composition.
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申请公布号 |
EP1997843(A1) |
申请公布日期 |
2008.12.03 |
申请号 |
EP20070738391 |
申请日期 |
2007.03.13 |
申请人 |
SHOWA DENKO K.K. |
发明人 |
ISHIHARA, YOSHIMITSU;INOUE, HIROFUMI;ONISHI, MINA |
分类号 |
C08G59/42;C08G18/08;C08K3/00;C08L63/00;C08L63/02;C08L75/04;C09D163/02;C09D175/04;H05K3/28 |
主分类号 |
C08G59/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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