发明名称 |
Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package |
摘要 |
Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output patterns formed on top and bottom surfaces of a base film. All the output patterns may pass over the first longer side. Alternatively, the output patterns connected to the output pads at the second longer side may pass over a shorter side. These pattern structures establish an effective pad arrangement without increasing the size of a TAB package, yet allowing reduced the chip size.
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申请公布号 |
US7459779(B2) |
申请公布日期 |
2008.12.02 |
申请号 |
US20050269362 |
申请日期 |
2005.11.07 |
申请人 |
SAMSUNG ELECTRIC CO., LTD. |
发明人 |
CHUNG YE-CHUNG;LEE SI-HOON |
分类号 |
H01L23/52;H01L23/48 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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