| 摘要 |
The TSV chip stack package is provided to select easily the chip when performing the device, by forming the different connection structure connecting the pad for chip selection and TSV between stacked angular chips. The size and height of package can be reduced. The TSV chip stack package(400) comprises a substrate(420); pads(412, 414) for the chip selection, stacked in the top of the substrate and penetration silicon vias; a rewiring connecting the pad for the chip selection and the penetration silicon via; a plurality of chips(410a, 410b, 410c, 410d) in which penetration silicon vias are connected; an outer connector(460) adhered to the substrate backside. |
