METHOD FOR FORMING METAL INTERCONNECTION LAYER OF SEMICONDUCTOR DEVICE,申请号KR20020037633-传众专利搜索

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发明名称	METHOD FOR FORMING METAL INTERCONNECTION LAYER OF SEMICONDUCTOR DEVICE
摘要
申请公布号	KR100871358(B1)	申请公布日期	2008.12.02
申请号	KR20020037633	申请日期	2002.06.29
申请人		发明人
分类号	H01L21/3205	主分类号	H01L21/3205
代理机构		代理人
主权项
地址

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