发明名称 Method for non-volatile memory fabrication
摘要 A method for non-volatile memory fabrication is provided, in which a substrate is provided, a bottom electrode is formed on the substrate, a solution with precursors of Zr and Sr is coated on the bottom electrode, the solution on the bottom electrode surface is dried and then fired to form a resistor layer of SrZrO3, and a top electrode is formed on the resistor layer.
申请公布号 US7459371(B2) 申请公布日期 2008.12.02
申请号 US20050293279 申请日期 2005.12.05
申请人 WINBOND ELECTRONICS CORP. 发明人 TSENG TSEUNG-YUEN;LIU CHIH-YI;CHUANG CHUN-CHIEH
分类号 H01L21/20;H01L21/8242 主分类号 H01L21/20
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