发明名称 |
Method and apparatus of measuring pattern dimension and controlling semiconductor device process having an error revising unit |
摘要 |
A method of measuring pattern dimensions includes evaluating a relationship between cross-sectional shapes of a pattern and measurement errors of a pattern in a specified image processing technique, and conducting an actual measurement in which dimension measurement of an evaluation objective pattern from image signals of a microscope is carried out, and revising errors of the dimension measurement of the evaluation objective pattern based on the relationship between the cross-sectional shapes of a pattern and the measurement errors of a pattern previously evaluated.
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申请公布号 |
US7459712(B2) |
申请公布日期 |
2008.12.02 |
申请号 |
US20070657689 |
申请日期 |
2007.01.25 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORPORATION |
发明人 |
TANAKA MAKI;MOROKUMA HIDETOSHI;SHISHIDO CHIE;TAKAGI YUJI |
分类号 |
G01B15/00;G01N21/86;G01B11/14;G01N23/225;H01J37/28;H01J37/304;H01L21/66 |
主分类号 |
G01B15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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