| 摘要 |
The method of manufacturing the semiconductor package is provided to reduce the fabrication process of the semiconductor package and the manufacturing cost and to prevent the damage of the semiconductor chip caused by the heat of the high temperature. The method of manufacturing the semiconductor package comprises as follows. A step is for manufacturing the semiconductor chip(10) having input-output pad(15). A step is for adhering the laminate film(23) including the reactive material and adhesive material on the semiconductor chip to cover the input-output pad, arranged in the base film phase(21). A step is for planarizing the upper side of the laminate film. A step is for exposing the part which corresponds to the input-output pad in the laminate film by using the reactive material. A step is for mounting the conductive element in the exposed input-output pad.
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