CONDUCTIVE PASTE WITH COPPER FILLER FOR EMI SHIELDING USE,申请号KR20060137527-传众专利搜索

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发明名称	CONDUCTIVE PASTE WITH COPPER FILLER FOR EMI SHIELDING USE
摘要
申请公布号	KR100871603(B1)	申请公布日期	2008.12.02
申请号	KR20060137527	申请日期	2006.12.29
申请人		发明人
分类号	H01B1/22	主分类号	H01B1/22
代理机构		代理人
主权项
地址

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