| 摘要 |
The semiconductor package monitoring and a method of manufacture thereof are provided to prevent the manufacture yield of the semiconductor package from being reduced by the wire bonding fail and to monitor the fault generated when bonding the bonding pad of the semiconductor chip and connection pad of substrate to the conductive wire. The semiconductor package(500) comprises the substrate(100), the semiconductor chip(200), and the connecting member(300) and the conductive element(400). The semiconductor package comprises the molding material(600). The substrate comprises the substrate body(10), the ground terminal(20), and the connection pad(30) and connection terminal(40). The substrate body having plat shape has the first side(1), the second side(2), and the side(3) and the penetration hole(5). The ground terminal and the connection pad are arranged on the first side of the substrate body. The pad part(35) having the disc shape is integrally formed in the end part of each connection pad. The conduction ball(38) like the solder ball is electrically connected on the pad part. The connection terminal is arranged on the second side of the substrate body. The semiconductor chip comprises the semiconductor chip body(205), and the bonding pad(210) and dummy pad(220). The connecting member electrically connects the ground terminal of substrate, the conductive via(45), the connection terminal and dummy pad of the semiconductor chip, and the connection pattern(230) and bonding pad. The conductive element connects electrically the bonding pad and the connection pad of the semiconductor chip exposed by the penetration hole. |
