发明名称 |
Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process |
摘要 |
An assembly structure for an electronic integrated power circuit, which circuit is fabricated on a semiconductor die having a plurality of contact pads associated with said integrated circuit and connected electrically to respective leads of said structure, wherein a shield element is coupled thermally to said die by a layer of an adhesive material.
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申请公布号 |
US7459771(B2) |
申请公布日期 |
2008.12.02 |
申请号 |
US20030369114 |
申请日期 |
2003.02.18 |
申请人 |
STMICROELECTRONICS, S.R.L. |
发明人 |
CASATI PAOLO;MAIERNA AMEDEO;MURARI BRUNO |
分类号 |
H01L23/495;H01L23/433;H01L23/552 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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