ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD

摘要

An electromagnetic bandgap structure and a printed circuit board are provided to obtain a low bandgap frequency while having a small size. A first dielectric layer is laminated on a first metal layer(320a). A mush type structure(330) includes a metal plate(332) laminated on the first dielectric layer and a via(334) of which one end is connected to the metal plate. A second dielectric layer(320b) is laminated on the metal plate and the first dielectric layer. The other end(334b) of the via is positioned in a hole(350) formed in the first metal layer and is connected to the first metal layer through the metal line. The other end of via is connected to a via land(360) positioned in the hole. The metal line(340) connects the via land and the first metal layer.