CIRCUIT BOARD, SEMICONDUCTOR PACKAGE HAVING THE BOARD, AND METHODS OF FABRICATING THE CIRCUIT BOARD AND THE SEMICONDUCTOR PACKAGE

摘要

A circuit board, a semiconductor package having the board, and methods of fabricating the circuit board and the semiconductor package are provided to connect the conductive stud of the semiconductor chip with the bonding pad tightly by forming the electrolytic plating layer on the bonding pads. A manufacturing method of the circuit board includes the step for providing the base substrate; the step for forming the first center plating lead line connected to the first bonding pads between first bonding pad lines, and the pair of first bonding pad lines arranged to the direction which from side to side crosses the top of the base substrate; the step for forming the electrolytic plating layer on first bonding pads; the step for exposing the base substrate by removing the center plating lead line.