| 摘要 |
A solder supply method is provided to fix the soldering composition of pad having the other aperture diameter of the top of the substrate including the flip- chip substrate after the reflow. A method supplies the soldering to the connection terminal of the substrate(1) including the connection terminal with the different aperture diameter. The solder supply method controls the amount of the soldering supplied on each connection terminal in order to make the difference of the content of the material diffused less than 0.2wt% within soldering from the connection terminal after the reflow on the connection terminal having the different aperture diameter. |
