发明名称 METHOD TO REDUCE ADHESION BETWEEN A CONFORMABLE REGION AND A PATTERN OF A MOLD
摘要 THE PRESENT INVENTION PROVIDES A METHOD TO REEDUCE ADHESION BETWEEN A CONFORMABLE REGION ON A SUBSTRATE AND A PATTERN OF A MOLD, WHICH SELECTIVELY COMES INTO CONTACT WITH THE CONFORMABLE REGION. THE METHOD FEATURES FORMING A CONFORMABLE MATERIAL ON THE SUBSTRATE AND CONTACTING THE CONFORMABLE MATERIAL WITH THE SURFACE. A CONDITIONED LAYER IS FORMED FROM THE CONFORMABLE MATERIAL. THE CONDITIONED LAYER HAS FIRST AND SECOND SUB-PORTIONS,WITH THE FIRST SUB-PORTION BEING SOLIDIFIED AND THE SECOND SUB-PORTION HAVING A FIRST AFFINITY FOR THE SURFACE AND A SECOND AFFINITY FOR THE FIRST SUB-PORTION.THE FIRST AFFINITY IS GREATER THAN THE SECOND AFFINITY. IN THIS FASHION, UPON SEPARATION OF THE MOLD FROM THE CONDITIONED LAYER, A SUBSET OF THE SECOND SUB-PORTION MAINTAINS CONTACT WITH THE MOLD,THEREBY REDUCING THE PROBABILITY THAT A PATTERN FORMED IN THE CONDITIONED LAYER BECOMES COMPROMISED.
申请公布号 MY136832(A) 申请公布日期 2008.11.28
申请号 MYPI20042293 申请日期 2004.06.15
申请人 MOLECULAR IMPRINTS, INC.;BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM 发明人 BYUNG-JIN CHOI;FRANK Y. XU;NICHOLAS A. STACEY;VAN N. TRUSKETT;MICHAEL P.C. WATTS
分类号 B29C;B29C59/00;G03F7/00 主分类号 B29C
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