STACK PACKAGE WITH RELEASING LAYER AND METHOD FOR FORMING THE SAME

摘要

Stack Package with Releasing Layer and Method for Forming the Same The present invention provides a structure and a of stacked dice package and a process for forming the same, wherein an elastic adhesive layer applied on the first die covering all top surface of the first die and forming rims at the peripheral edges of the first die except the openings formed on the first contacting pads. With this shape of the elastic adhesive layer, the present invention can avoid micro crack happens in the die while performing wire bonding on the contacting pad of the die.